Melnik (R.)V.N.
Design Automation in Electronics, 44, 123-128, 1991
Thermal conditions of integrated microcircuits play a fundamental role in developing more reliable electronic components and devices. The well-known problem of "self-heating" of electronic components and devices leads to serious limitations of a degree of integration of electronic elements on the substrate. As a result, IC thermal conditions will largely determine further progress in the field of electronics. Mathematically, problems of determing thermal conditions of integrated circuits can be reduced to solving partial differential equations. In this contribution, we show how to decrease the number of iterations for achieving a pre-defined accuracy in typical problems of calculating IC thermal conditions. Furthermore, we show that the proposed mathematical model, developed under the assumption of smallness of the substrate thickness compared to its geometric dimensions in the topology plane, can effectively take into account different practical ways of IC substrate mounting in electronic applications.